Semiconductor Science and Technology | |
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년도 | 2013 |
학술지명 | Semiconductor Science and Technology |
논문명 | Thermal Property of Transparent Silver Nanowire Films |
게재권/집 | 29/1 |
수록페이지 | 015002 |
저자명 | Jongwoon Park, Dong-Kyun Shin, Jaeho Ahn, and Jung-Yong Lee* |
Link |
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Abstract Through a comparison with transparent polymer composite films, we investigate the thermal property of transparent silver nanowire (AgNW) films that may be employed for heat sink in transparent electronic devices. To fabricate transparent polymer composite films and enhance their thermal property, poly(methyl methacrylate) (PMMA) solution featuring high transparency (~90%) and thermal emissivity (0.9) is mixed with thermal conductive fillers such as aluminum nitride (AlN) and silicon carbide (SiC). It is observed that the thermal emissivity of the AgNW films is decreased as the sheet resistance is reduced. However, we have found that the AgNW film shows the most excellent heat dissipation property (53.7 °C) while maintaining relatively higher transparency (77.1% at 520 nm), followed by the PMMA:SiC and then PMMA:AlN films. |